DDR RAM Thermal Pad

10.0mm Thickness 2.9g/cc Density No Volatilization Silicon Free Thermal Pad

Product feature
■ Thermal conductivity:2.0,3.0W/m.K
■ Naturally tacky, easing application
■ Silicone free
■ Excellent, high volume applications
■ Excellent electrical isolation
■ Excellent compression vs. deflection performance.

■ No siloxane volatilization

■ High thermal conductivity

■ High insulation

■ High compressibility

Typical applications
■ Fiber Optics
■ Medical Device
■ Hard Disc Driver
■ Automotive Sensors and Modules
■ Silicon Sensitive Components
■ Hard disk

■ Optical precision equipment

■ Notebook computer, projector and OA office electronic products

■ Mobile and communication equipment, high-speed mass

■ Storage drives, heat pipe assemblies, automotive engine control equipment

■ Telecommunication hardware and equipment, high-end industrial control and medical electronics

Purchase information

Standard size: 200*400mm, which can be die-cut into various sizes and shapes as specified by customers. The increasing gradient of thickness is 0.25mm

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